:no_upscale()/Bond-Elut_02.jpg)
Agilent Technologies
Agilent Technologies SPE-Kartusche Mega Bond Elut-2OH, 1 g, 6 ml, 30 St/Pkg
Bond Elut Diol resembles un-bonded silica in its tendency for strong hydrogen bonding with analytes. 20H can also be employed in the non-polar mode because the hydrocarbon spacer on its functional group provides enough non-polar character for retention of hydrophobic analytes. Bond Elut Diol is a listed SPE device for the DIN 14333-1 method on benzimidazole fungicides.Mehr anzeigen
Angebot
Alle Preise inkl. MwSt.; Versandkosten laut Shop-Feed. Der Klick führt dich direkt zur Produktseite des Shops.
Preisverlauf (Tiefstpreis)
Produktdetails
- Hersteller
- Agilent Technologies
- Kategorien
- Wirtschaft & Industrie > Wissenschaft & Labor > Laborbedarf
Ähnliche Produkte
Bandelin SONOREX GV 10 Griffverstellung, 2 St/Pkg1 Angebotab € 97,58
Agilent Technologies GC-Säule CARBOBOND Fused Silica 25m x 0,53mm, 10 μm1 Angebotab € 1.143,59
Bandelin SONOPULS EH 3.1 Reaktionscuphalter1 Angebotab € 154,70
Exmere HPLC-Säule Exsil Pure 120 Amino, 3μm 150 x 4,6mm1 Angebotab € 547,40
Agilent Technologies GC-Kapillarsäule Select FAME FS 100m x 0,25mm1 Angebotab € 3.045,21
Quadrex GC-Säule Quadrex 007-1, 30 m x 0,25 mm ID, 0,01 μm film1 Angebotab € 581,59